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The Chemical Educator

ISSN: 1430-4171 (electronic version)

Table of Contents

Abstract Volume 12 Issue 1 (2007) pp 29-32
DOI 10.1333/s00897072000a

Multidimensional Instrumentation Applied to Studies of Electrodeposition

Brian J. Polk* and Felix Duvallet

National Institute of Standards and Technology, Semiconductor Electronics Division, Gaithersburg, MD 20899-8120,
Received June 6, 2006. Accepted November 22, 2006.

Published online: 25 January 2007

Abstract. A multidimensional instrument comprised of a computer, an analytical balance, a current and voltage source-meter, and interfacing software is applied to a demonstration of copper electroplating. Together, the data acquisition system monitors four variables: voltage, current, weight, and time. The data system may be used to teach either instrumental interfacing or electrochemical concepts. An analytical expression which predicts the weight change of a sample undergoing electroplating as the weight of the sample is measured directly in the plating solution is presented. Experimental values of the weight change rate were found to agree with predicted values for current densities in the range of 1 mA cm2 to 10 mA cm2. Several alternative demonstration experiments that utilize the same data system are suggested.

Key Words: Laboratories and Demonstrations; quantitative analysis; instrumental analysis; electrochemistry; electroplating; electrodeposition; copper; instrumental methods; gravimetric analysis; laboratory computing/interfacing; laboratory equipment/apparatus; potentiometry

(*) Corresponding author. (E-mail:

Article in PDF format (170 KB) HTML format

Supporting Materials:

Details on assembling the data system, writing the interfacing software, as well as details about performing and interpreting the electroplating experiments can be found in the supporting materials. The software source code is also available. The supporting material also contains the derivation of eq 1 as well as additional references. It may be downloaded in a Zip file (828 KB).

Issue date: February 1, 2007

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