The Chemical Educator
ISSN: 1430-4171 (electronic version)
Abstract Volume 12
Issue 1 (2007) pp 29-32
Multidimensional Instrumentation Applied to Studies of Electrodeposition
Brian J. Polk* and Felix Duvallet
National Institute of Standards and Technology, Semiconductor
Electronics Division, Gaithersburg, MD 20899-8120, email@example.com
Published online: 25 January 2007
Abstract. A multidimensional instrument comprised of a computer, an analytical balance, a current and voltage source-meter, and interfacing software is applied to a demonstration of copper electroplating. Together, the data acquisition system monitors four variables: voltage, current, weight, and time. The data system may be used to teach either instrumental interfacing or electrochemical concepts. An analytical expression which predicts the weight change of a sample undergoing electroplating as the weight of the sample is measured directly in the plating solution is presented. Experimental values of the weight change rate were found to agree with predicted values for current densities in the range of 1 mA cm–2 to 10 mA cm–2. Several alternative demonstration experiments that utilize the same data system are suggested.
Key Words: Laboratories and Demonstrations; quantitative analysis; instrumental analysis; electrochemistry; electroplating; electrodeposition; copper; instrumental methods; gravimetric analysis; laboratory computing/interfacing; laboratory equipment/apparatus; potentiometry
(*) Corresponding author. (E-mail: firstname.lastname@example.org)
Supporting Materials:Details on assembling the data system, writing the interfacing software, as well as details about performing and interpreting the electroplating experiments can be found in the supporting materials. The software source code is also available. The supporting material also contains the derivation of eq 1 as well as additional references. It may be downloaded in a Zip file (828 KB).
Issue date: February 1, 2007